AM29LV800DB-70WBC
vs
AM29LV800BB-70WBF
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
6 X 9 MM, 0.80 MM PITCH, FBGA-48
Pin Count
48
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Additional Feature
BOTTOM BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
Command User Interface
YES
YES
Data Polling
YES
YES
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
Length
9 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Sectors/Size
1,2,1,15
1,2,1,15
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Equivalence Code
BGA48,6X8,32
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Seated Height-Max
1.2 mm
Sector Size
16K,8K,32K,64K
16K,8K,32K,64K
Standby Current-Max
0.000005 A
0.000005 A
Supply Current-Max
0.03 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Width
6 mm
Base Number Matches
2
3
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