AM29LV800BB90SEB
vs
AM29LV800BB90SI
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SPANSION INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
MO-180AA, SOP-44
|
SOP,
|
| Pin Count |
44
|
44
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.51
|
|
| Access Time-Max |
90 ns
|
90 ns
|
| Additional Feature |
CONFG AS 512K X 16; BOTTOM BOOT BLOCK
|
CONFG AS 512K X 16; BOTTOM BOOT BLOCK
|
| Alternate Memory Width |
8
|
8
|
| Boot Block |
BOTTOM
|
|
| Command User Interface |
YES
|
|
| Data Polling |
YES
|
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-G44
|
R-PDSO-G44
|
| JESD-609 Code |
e0
|
e0
|
| Length |
28.2 mm
|
28.2 mm
|
| Memory Density |
8388608 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
1,2,1,15
|
|
| Number of Terminals |
44
|
44
|
| Number of Words |
524288 words
|
1048576 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
512KX16
|
512KX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP44,.63
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
|
| Seated Height-Max |
2.8 mm
|
2.8 mm
|
| Sector Size |
16K,8K,32K,64K
|
|
| Standby Current-Max |
0.000005 A
|
|
| Supply Current-Max |
0.03 mA
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Toggle Bit |
YES
|
|
| Type |
NOR TYPE
|
|
| Width |
13.3 mm
|
13.3 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare AM29LV800BB90SEB with alternatives
Compare AM29LV800BB90SI with alternatives