AM29LV800BB70RSE vs AM29LV800BB70SCB feature comparison

AM29LV800BB70RSE Spansion

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AM29LV800BB70SCB AMD

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code SOIC SOIC
Package Description SOP, MO-180AA, SOP-44
Pin Count 44 44
Reach Compliance Code compliant unknown
Access Time-Max 70 ns 70 ns
Additional Feature CONFG AS 512K X 16; BOTTOM BOOT BLOCK CONFG AS 512K X 16; BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e0
Length 28.2 mm 28.2 mm
Memory Density 16777216 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 1048576 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 13.3 mm 13.3 mm
Base Number Matches 3 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Category CO2 Kg 12
Compliance Temperature Grade Commercial: +0C to +70C
Boot Block BOTTOM
Type NOR TYPE

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