AM29LV800BB120VAI vs MBM29DL800TA-12PBT feature comparison

AM29LV800BB120VAI AMD

Buy Now Datasheet

MBM29DL800TA-12PBT FUJITSU Semiconductor Limited

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code BGA BGA
Package Description 8 X 6 MM, 0.80 MM PITCH, FBGA-48 PLASTIC, FINE PITCH, BGA-48
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 120 ns
Alternate Memory Width 16
Boot Block BOTTOM TOP
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 8 mm 9 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 6 mm 6 mm
Base Number Matches 2 4
Additional Feature CONFIGURABLE AS 512K X 16

Compare AM29LV800BB120VAI with alternatives

Compare MBM29DL800TA-12PBT with alternatives