AM29LV800B-90REI
vs
MBM29LV800BA-90PFTR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
CYPRESS SEMICONDUCTOR CORP
FUJITSU SEMICONDUCTOR AMERICA INC
Reach Compliance Code
compliant
unknown
Base Number Matches
3
3
Part Package Code
TSOP1
Package Description
PLASTIC, REVERSE, TSOP1-48
Pin Count
48
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
90 ns
Additional Feature
MINIMUM 100000 PROGRAM/ERASE CYCLES
Alternate Memory Width
8
Boot Block
BOTTOM
JESD-30 Code
R-PDSO-G48
Length
18.4 mm
Memory Density
8388608 bit
Memory IC Type
FLASH
Memory Width
16
Number of Functions
1
Number of Terminals
48
Number of Words
524288 words
Number of Words Code
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
Package Body Material
PLASTIC/EPOXY
Package Code
TSOP1-R
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
DUAL
Type
NOR TYPE
Width
12 mm
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