AM29LV641DH101RFIN vs TE28F640B3BC100 feature comparison

AM29LV641DH101RFIN AMD

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TE28F640B3BC100 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC INTEL CORP
Part Package Code TSOP1 TSOP
Package Description REVERSE, MO-142DD, TSOP-48 12 X 20 MM, TSOP-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 100 ns 100 ns
Command User Interface YES YES
Common Flash Interface YES
Data Polling YES NO
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e0
Length 18.4 mm 18.4 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 128 8,127
Number of Terminals 48 48
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1-R TSOP1
Package Equivalence Code TSSOP48,.8,20 TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Reverse Pinout YES
Seated Height-Max 1.2 mm 1.2 mm
Sector Size 32K 4K,32K
Standby Current-Max 0.000005 A 0.000005 A
Supply Current-Max 0.03 mA 0.055 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Toggle Bit YES NO
Type NOR TYPE NOR TYPE
Width 12 mm 12 mm
Base Number Matches 2 2
Additional Feature BOTTOM BOOT BLOCK
Boot Block BOTTOM

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