AM29LV640DU120RWHE
vs
MBM29DL640E12PBT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA63,8X12,32
PLASTIC, FBGA-63
Pin Count
63
63
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
120 ns
120 ns
Additional Feature
HARDWARE DATA PROTECTION/RESET PIN, 1 MILLION ERASE CYCLES PER SECTOR
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e0
Length
12 mm
11 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
2
Number of Sectors/Size
128
Number of Terminals
63
63
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA63,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
NOR TYPE
Width
11 mm
10 mm
Base Number Matches
3
3
Alternate Memory Width
8
Compare AM29LV640DU120RWHE with alternatives
Compare MBM29DL640E12PBT with alternatives