AM29LV400T70RFC vs AM29LV400BB-70EC feature comparison

AM29LV400T70RFC AMD

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AM29LV400BB-70EC Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code TSOP TSOP
Package Description REVERSE, TSOP-48 TSOP-48
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature CONFG AS 256K X 16; TOP BOOT BLOCK CONFG AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK
Boot Block TOP
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX8 512KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Type NOR TYPE
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Length 18.4 mm
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 240
Seated Height-Max 1.2 mm
Terminal Finish TIN LEAD
Terminal Pitch 0.5 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm

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Compare AM29LV400BB-70EC with alternatives