AM29LV400BT-90WAE vs AM29LV400T80WAE feature comparison

AM29LV400BT-90WAE Spansion

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AM29LV400T80WAE AMD

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code BGA BGA
Package Description TFBGA, 6 X 8 MM, 0.80 MM PITCH, FBGA-48
Pin Count 48 48
Reach Compliance Code compliant unknown
Access Time-Max 90 ns 80 ns
Additional Feature CONFG AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION; TOP BOOT BLOCK CONFG AS 256K X 16; TOP BOOT BLOCK
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0
Length 8 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 512KX8 512KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 6 mm
Base Number Matches 2 1
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.51
Boot Block TOP
Type NOR TYPE

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