AM29LV400BT-120WAD vs AM29LV400T-120WAI feature comparison

AM29LV400BT-120WAD Spansion

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AM29LV400T-120WAI Cypress Semiconductor

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description TFBGA, ,
Pin Count 48
Reach Compliance Code compliant compliant
Access Time-Max 120 ns
Additional Feature CONFIGURABLE AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION
JESD-30 Code R-PBGA-B48
JESD-609 Code e3
Length 8 mm
Memory Density 4194304 bit
Memory IC Type FLASH
Memory Width 8
Number of Functions 1
Number of Terminals 48
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX8
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 6 mm
Base Number Matches 1 2
ECCN Code EAR99
HTS Code 8542.32.00.51

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