AM29LV400BB55RWAK vs M29W400FB55ZA3SE feature comparison

AM29LV400BB55RWAK AMD

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M29W400FB55ZA3SE Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC MICRON TECHNOLOGY INC
Package Description FBGA, BGA48,6X8,32 TFBGA,
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 55 ns 55 ns
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
Command User Interface YES
Data Polling YES
Endurance 1000000 Write/Erase Cycles
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Sectors/Size 1,2,1,7
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA TFBGA
Package Equivalence Code BGA48,6X8,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified
Ready/Busy YES
Sector Size 16K,8K,32K,64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Toggle Bit YES
Type NOR TYPE NOR TYPE
Base Number Matches 2 1
Part Package Code BGA
Pin Count 48
Additional Feature BOTTOM BOOT BLOCK
Length 8 mm
Number of Functions 1
Operating Mode ASYNCHRONOUS
Programming Voltage 3 V
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Width 6 mm

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