AM29LV400BB-60RWJC1
vs
AM29F400BB-90DGE2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Part Package Code
WAFER
DIE
Package Description
WAFER-43
DIE,
Pin Count
43
43
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
60 ns
90 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-XUUC-N43
R-XUUC-N43
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
43
43
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
256KX16
256KX16
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
3 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Type
NOR TYPE
NOR TYPE
Base Number Matches
1
1
Additional Feature
MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION
Data Retention Time-Min
20
Compare AM29LV400BB-60RWJC1 with alternatives
Compare AM29F400BB-90DGE2 with alternatives