AM29LV400BB-55RWAD vs AM29LV400BB-120WAI feature comparison

AM29LV400BB-55RWAD Spansion

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AM29LV400BB-120WAI Spansion

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, TFBGA,
Pin Count 48 48
Reach Compliance Code compliant compliant
Access Time-Max 55 ns 120 ns
Additional Feature CONFIGURABLE AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION CONFG AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e3 e0
Length 8 mm 8 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512KX8 512KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 30
Width 6 mm 6 mm
Base Number Matches 2 2
Pbfree Code No
Moisture Sensitivity Level 3

Compare AM29LV400BB-55RWAD with alternatives

Compare AM29LV400BB-120WAI with alternatives