AM29LV400BB-120WAE
vs
AM29LV400BT-55RWAI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA,
Pin Count
48
48
Reach Compliance Code
compliant
unknown
Access Time-Max
120 ns
55 ns
Additional Feature
CONFG AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION; BOTTOM BOOT BLOCK
CONFG AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION; TOP BOOT BLOCK
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
Length
8 mm
8 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
512KX8
512KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
6 mm
6 mm
Base Number Matches
2
2
Compare AM29LV400BB-120WAE with alternatives
Compare AM29LV400BT-55RWAI with alternatives