AM29LV400B90WAI
vs
AM29LV400BT-55RWAI
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
6 X 8 MM, 0.80 MM PITCH, FBGA-48
|
TFBGA,
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Access Time-Max |
90 ns
|
55 ns
|
| Additional Feature |
CONFG AS 256K X 16; BOTTOM BOOT BLOCK
|
CONFG AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION; TOP BOOT BLOCK
|
| Boot Block |
BOTTOM
|
|
| JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512KX8
|
512KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Type |
NOR TYPE
|
|
| Base Number Matches |
1
|
2
|
| Length |
|
8 mm
|
| Seated Height-Max |
|
1.2 mm
|
| Terminal Pitch |
|
0.8 mm
|
| Width |
|
6 mm
|
|
|
|
Compare AM29LV400B90WAI with alternatives
Compare AM29LV400BT-55RWAI with alternatives