AM29LV400B90WAI vs AM29LV400BT-120WAE feature comparison

AM29LV400B90WAI AMD

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AM29LV400BT-120WAE AMD

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code BGA BGA
Package Description 6 X 8 MM, 0.80 MM PITCH, FBGA-48 TFBGA,
Pin Count 48 48
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 90 ns 120 ns
Additional Feature CONFG AS 256K X 16; BOTTOM BOOT BLOCK CONFG AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION; TOP BOOT BLOCK
Boot Block BOTTOM
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 512KX8 512KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Base Number Matches 1 2
Length 8 mm
Seated Height-Max 1.2 mm
Terminal Pitch 0.8 mm
Width 6 mm

Compare AM29LV400B90WAI with alternatives

Compare AM29LV400BT-120WAE with alternatives