AM29LV400B-120WAC
vs
AM29LV400BB-120WAD
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
SPANSION INC
|
| Package Description |
,
|
TFBGA,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
48
|
| Access Time-Max |
|
120 ns
|
| Additional Feature |
|
CONFIGURABLE AS 256K X 16; EMBEDDED ALGORITHMS; 20 YEAR DATA RETENTION
|
| JESD-30 Code |
|
R-PBGA-B48
|
| JESD-609 Code |
|
e3
|
| Length |
|
8 mm
|
| Memory Density |
|
4194304 bit
|
| Memory IC Type |
|
FLASH
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
48
|
| Number of Words |
|
524288 words
|
| Number of Words Code |
|
512000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
512KX8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TFBGA
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Programming Voltage |
|
3 V
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
6 mm
|
|
|
|
Compare AM29LV400BB-120WAD with alternatives