AM29LV256MH98REF vs AM29LV256ML99REI feature comparison

AM29LV256MH98REF Spansion

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AM29LV256ML99REI AMD

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code TSOP TSOP1
Package Description TSOP-56 MO-142B, TSOP-56
Pin Count 56 56
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
Boot Block BOTTOM/TOP BOTTOM/TOP
JESD-30 Code R-PDSO-G56 R-PDSO-G56
JESD-609 Code e3 e0
Length 18.4 mm 18.4 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 56 56
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 14 mm 14 mm
Base Number Matches 1 2
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Number of Sectors/Size 512
Package Equivalence Code TSSOP56,.8,20
Page Size 4/8 words
Ready/Busy YES
Sector Size 64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.06 mA
Toggle Bit YES

Compare AM29LV256MH98REF with alternatives

Compare AM29LV256ML99REI with alternatives