AM29LV200BT-70RFI vs AM29F200BB90FE feature comparison

AM29LV200BT-70RFI AMD

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AM29F200BB90FE Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code TSOP1 TSOP
Package Description REVERSE, MO-142DD, TSOP-48 SOP,
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns 90 ns
Additional Feature TOP BOOT BLOCK CONFG AS 128K X 16; BOTTOM BOOT BLOCK
Alternate Memory Width 16
Boot Block TOP
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 256KX8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1-R SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 12 mm
Base Number Matches 2 2
Rohs Code No
JESD-609 Code e0
Peak Reflow Temperature (Cel) 240
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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Compare AM29F200BB90FE with alternatives