AM29LV200BT-50RFI vs AM29F200BB50FF feature comparison

AM29LV200BT-50RFI AMD

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AM29F200BB50FF Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code TSOP TSOP
Package Description TSOP1-R, SOP,
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 50 ns 50 ns
Additional Feature MIN 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; CAN BE CONFG AS 128K X 16; TOP BOOT BLOCK CONFIGURABLE AS 128K X 16
Boot Block TOP
Data Retention Time-Min 20
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1-R SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 3 V 4.75 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 12 mm
Base Number Matches 2 1
Rohs Code Yes
JESD-609 Code e3
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40

Compare AM29LV200BT-50RFI with alternatives

Compare AM29F200BB50FF with alternatives