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AM29LV200BB-70RWJK1 vs AM29LV200BB-70DFC1 feature comparison

AM29LV200BB-70RWJK1 Spansion

Buy Now Datasheet

AM29LV200BB-70DFC1 Spansion

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code WAFER DIE
Package Description WAFER-43 DIE-43
Pin Count 43 43
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-XUUC-N43 R-XUUC-N43
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 43 43
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 128KX16 128KX16
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Type NOR TYPE NOR TYPE
Base Number Matches 1 1
Memory » Flash Memories
Memory » Flash Memories

Compare AM29LV200BB-70RWJK1 with alternatives

Compare AM29LV200BB-70DFC1 with alternatives