AM29LV200BB-70RSC vs AM29F200BB50SD feature comparison

AM29LV200BB-70RSC Spansion

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AM29F200BB50SD Spansion

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC SPANSION INC
Part Package Code SOIC SOIC
Package Description MO-180AA, SOP-44 SOP,
Pin Count 44 44
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns 50 ns
Additional Feature BOTTOM BOOT BLOCK CONFIGURABLE AS 128K X 16
Alternate Memory Width 8
Boot Block BOTTOM
JESD-30 Code R-PDSO-G44 R-PDSO-G44
JESD-609 Code e0 e3
Length 28.2 mm
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 16 8
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 44 44
Number of Words 131072 words 262144 words
Number of Words Code 128000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 128KX16 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 3 V 4.75 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 13.3 mm
Base Number Matches 2 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

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