Findchips: Compare AM29LV200BB-60RDRD vs AM29LV200BB-60RWJI1

AM29LV200BB-60RDRD vs AM29LV200BB-60RWJI1 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	SPANSION INC	SPANSION INC
Part Package Code	DIE	WAFER
Package Description	DIE-43	WAFER-43
Pin Count	43	43
Reach Compliance Code	compliant	compliant
ECCN Code	EAR99	EAR99
HTS Code	8542.32.00.51	8542.32.00.51
Access Time-Max	60 ns	60 ns
Additional Feature	BOTTOM BOOT BLOCK	BOTTOM BOOT BLOCK
Alternate Memory Width	8	8
Boot Block	BOTTOM	BOTTOM
JESD-30 Code	R-XUUC-N43	R-XUUC-N43
Memory Density	2097152 bit	2097152 bit
Memory IC Type	FLASH	FLASH
Memory Width	16	16
Number of Functions	1	1
Number of Terminals	43	43
Number of Words	131072 words	131072 words
Number of Words Code	128000	128000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	70 °C	85 °C
Operating Temperature-Min		-40 °C
Organization	128KX16	128KX16
Package Body Material	UNSPECIFIED	UNSPECIFIED
Package Code	DIE	DIE
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	UNCASED CHIP	UNCASED CHIP
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Cel)	260
Programming Voltage	3 V	3 V
Qualification Status	Not Qualified	Not Qualified
Supply Voltage-Max (Vsup)	3.6 V	3.6 V
Supply Voltage-Min (Vsup)	2.7 V	3 V
Supply Voltage-Nom (Vsup)	3 V	3.3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Form	NO LEAD	NO LEAD
Terminal Position	UPPER	UPPER
Time@Peak Reflow Temperature-Max (s)	40
Type	NOR TYPE	NOR TYPE
Base Number Matches	1	1
JESD-609 Code		e0
Terminal Finish		TIN LEAD
	Memory » Flash Memories	Memory » Flash Memories