AM29LV160MB-90FI
vs
MBM29DL162BE-90TR
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Part Package Code |
TSOP
|
TSOP1
|
| Package Description |
TSOP1-R,
|
PLASTIC, REVERSE, TSOP1-48
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
90 ns
|
90 ns
|
| Additional Feature |
BOTTOM BOOT BLOCK
|
|
| Alternate Memory Width |
8
|
8
|
| JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
| Length |
18.4 mm
|
18.4 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
48
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1MX16
|
1MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP1-R
|
TSOP1-R
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
12 mm
|
12 mm
|
| Base Number Matches |
2
|
3
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.51
|
| Boot Block |
|
BOTTOM
|
| Technology |
|
CMOS
|
| Type |
|
NOR TYPE
|
|
|
|
Compare AM29LV160MB-90FI with alternatives
Compare MBM29DL162BE-90TR with alternatives