AM29LV160DB70SE vs AM29DL162CT-70EI feature comparison

AM29LV160DB70SE Spansion

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AM29DL162CT-70EI AMD

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code SOIC TSOP
Package Description SOP, TSOP1,
Pin Count 44 48
Reach Compliance Code compliant unknown
Access Time-Max 70 ns 70 ns
Additional Feature EMBEDDED ALGORITHMS; 20 YEARS DATA RETENTION; BOTTOM BOOT BLOCK USER CONFIGURABLE AS 1M X 16
Alternate Memory Width 8
JESD-30 Code R-PDSO-G44 R-PDSO-G48
JESD-609 Code e0
Length 28.2 mm 18.4 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 44 48
Number of Words 1048576 words 2097152 words
Number of Words Code 1000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 1MX16 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 13.3 mm 12 mm
Base Number Matches 2 4

Compare AM29LV160DB70SE with alternatives

Compare AM29DL162CT-70EI with alternatives