AM29LV160BT80WCK
vs
EN29LV160T-70BI
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
SPANSION INC
|
EON SILICON SOLUTION INC
|
Part Package Code |
BGA
|
|
Package Description |
TFBGA, BGA48,6X8,32
|
TFBGA, BGA48,6X8,32
|
Pin Count |
48
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
80 ns
|
70 ns
|
Additional Feature |
TOP BOOT BLOCK
|
|
Alternate Memory Width |
8
|
8
|
Boot Block |
TOP
|
TOP
|
Command User Interface |
YES
|
YES
|
Common Flash Interface |
YES
|
YES
|
Data Polling |
YES
|
YES
|
JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
JESD-609 Code |
e1
|
|
Length |
9 mm
|
8 mm
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
1,2,1,31
|
1,2,1,31
|
Number of Terminals |
48
|
48
|
Number of Words |
1048576 words
|
1048576 words
|
Number of Words Code |
1000000
|
1000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Organization |
1MX16
|
1MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA48,6X8,32
|
BGA48,6X8,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Programming Voltage |
3 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
YES
|
Seated Height-Max |
1.2 mm
|
1.1 mm
|
Sector Size |
16K,8K,32K,64K
|
16K,8K,32K,64K
|
Standby Current-Max |
0.000005 A
|
0.000005 A
|
Supply Current-Max |
0.03 mA
|
0.016 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Toggle Bit |
YES
|
YES
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
8 mm
|
6 mm
|
Base Number Matches |
1
|
2
|
Data Retention Time-Min |
|
20
|
Endurance |
|
100000 Write/Erase Cycles
|
Write Cycle Time-Max (tWC) |
|
0.00007 ms
|
|
|
|
Compare AM29LV160BT80WCK with alternatives
Compare EN29LV160T-70BI with alternatives