AM29LV160BT80FI vs TE28F160C18T90 feature comparison

AM29LV160BT80FI Spansion

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TE28F160C18T90 Intel Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC INTEL CORP
Part Package Code TSOP TSOP
Package Description TSOP1-R, 12 X 20 MM, TSOP-48
Pin Count 48 48
Reach Compliance Code compliant unknown
Access Time-Max 80 ns 90 ns
Additional Feature TOP BOOT BLOCK MIN 100K BLOCK ERASE CYCLES; AUTOMATED WORD PROGRAM AND BLOCK ERASE; TOP BOOT BLOCK
Alternate Memory Width 8
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0
Length 18.4 mm 18.4 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1-R TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 1.95 V
Supply Voltage-Min (Vsup) 2.7 V 1.65 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm 12 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block TOP
Type NOR TYPE

Compare AM29LV160BT80FI with alternatives

Compare TE28F160C18T90 with alternatives