AM29LV160BB80REC vs M29S160TB3TKB80 feature comparison

AM29LV160BB80REC AMD

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M29S160TB3TKB80 Motorola Semiconductor Products

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC MOTOROLA INC
Part Package Code TSOP
Package Description TSOP-48 12 X 20 MM, TSOP1-48
Pin Count 48
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 80 ns 80 ns
Additional Feature USER CONFG AS 1M X 16; BOTTOM BOOT BLOCK
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX8 2MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Base Number Matches 2 1
Alternate Memory Width 16
Length 18.4 mm
Seated Height-Max 1.2 mm
Terminal Pitch 0.5 mm
Width 12 mm

Compare AM29LV160BB80REC with alternatives

Compare M29S160TB3TKB80 with alternatives