AM29LV160BB80EE vs AM29F160DB55EC feature comparison

AM29LV160BB80EE Spansion

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AM29F160DB55EC AMD

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code TSOP TSOP
Package Description TSOP1, SOP,
Pin Count 48 48
Reach Compliance Code compliant unknown
Access Time-Max 80 ns 55 ns
Additional Feature BOTTOM BOOT BLOCK CONFG AS 1M X 16; 1000K WRITE CYCLES MIN; DATA RETENTION 20 YEARS; BOTTOM BOOT BLOCK
Alternate Memory Width 8
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0
Length 18.4 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 2097152 words
Number of Words Code 1000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 1MX16 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 2.7 V 4.75 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 12 mm
Base Number Matches 2 2
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block BOTTOM
Data Retention Time-Min 20
Type NOR TYPE

Compare AM29LV160BB80EE with alternatives

Compare AM29F160DB55EC with alternatives