AM29LV160BB80EC
vs
MBM29LV160T-80PFTN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
TSOP
TSOP1
Package Description
TSOP1,
PLASTIC, TSOP1-48
Pin Count
48
48
Reach Compliance Code
compliant
unknown
Access Time-Max
80 ns
80 ns
Additional Feature
BOTTOM BOOT BLOCK
CONFIGURABLE AS 1M X 16; 100000 PROGRAM/ERASE CYCLES MIN
Alternate Memory Width
8
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e0
Length
18.4 mm
18.4 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
2097152 words
Number of Words Code
1000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-20 °C
Organization
1MX16
2MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
12 mm
12 mm
Base Number Matches
2
1
ECCN Code
EAR99
HTS Code
8542.32.00.51
Boot Block
TOP
Type
NOR TYPE
Compare AM29LV160BB80EC with alternatives
Compare MBM29LV160T-80PFTN with alternatives