AM29LV160BB120VAC
vs
MBM29LV160TE12PBT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
FUJITSU LTD
Part Package Code
BGA
Package Description
8 X 6 MM, 0.80 MM PITCH, FBGA-48
PLASTIC, FBGA-48
Pin Count
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
120 ns
120 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM
TOP
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8 mm
8 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
2097152 words
Number of Words Code
1000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX16
2MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Base Number Matches
2
4
Rohs Code
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-609 Code
e0
Number of Sectors/Size
1,2,1,31
Package Equivalence Code
BGA48,6X8,32
Ready/Busy
YES
Sector Size
16K,8K,32K,64K
Standby Current-Max
0.000005 A
Supply Current-Max
0.035 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Toggle Bit
YES
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