AM29LV102BB-55RJF
vs
AM29LV102BT-55RJC
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
SPANSION INC
|
ADVANCED MICRO DEVICES INC
|
Part Package Code |
QFJ
|
QFJ
|
Package Description |
PLASTIC, LCC-32
|
PLASTIC, LCC-32
|
Pin Count |
32
|
32
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
55 ns
|
55 ns
|
Boot Block |
BOTTOM
|
|
JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
JESD-609 Code |
e3
|
|
Length |
13.97 mm
|
13.97 mm
|
Memory Density |
2097152 bit
|
2097152 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
256KX8
|
256KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
3 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.55 mm
|
3.55 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Type |
NOR TYPE
|
|
Width |
11.43 mm
|
11.43 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare AM29LV102BB-55RJF with alternatives
Compare AM29LV102BT-55RJC with alternatives