AM29LV065DU90RWHFB
vs
AM29LV065DU121RWHEB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
BGA
Package Description
11 X 12 MM, 0.80 MM PITCH, FBGA-63
11 X 12 MM, 0.80 MM PITCH, FBGA-63
Pin Count
63
63
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
120 ns
Boot Block
BOTTOM/TOP
BOTTOM/TOP
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e1
Length
12 mm
12 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
8MX8
8MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
11 mm
11 mm
Base Number Matches
1
1
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