AM29LV065DU120RWHIB vs AM29LV065DU120RWHKB feature comparison

AM29LV065DU120RWHIB AMD

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AM29LV065DU120RWHKB Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code BGA BGA
Package Description 11 X 12 MM, 0.80 MM PITCH, FBGA-63 11 X 12 MM, 0.80 MM PITCH, FBGA-63
Pin Count 63 63
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 120 ns
Boot Block BOTTOM/TOP BOTTOM/TOP
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Length 12 mm 12 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8MX8 8MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 11 mm 11 mm
Base Number Matches 2 1
Rohs Code Yes
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER

Compare AM29LV065DU120RWHIB with alternatives

Compare AM29LV065DU120RWHKB with alternatives