AM29LV033C90EI vs AM29F032B-75ECB feature comparison

AM29LV033C90EI Spansion

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AM29F032B-75ECB AMD

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code TSOP TSOP
Package Description TSOP1, TSOP-40
Pin Count 40 40
Reach Compliance Code compliant unknown
Access Time-Max 90 ns 70 ns
Additional Feature MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION 1000K WRITE/ERASE CYCLES MIN
JESD-30 Code R-PDSO-G40 R-PDSO-G40
JESD-609 Code e0
Length 18.4 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4MX8 4MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 5.25 V
Supply Voltage-Min (Vsup) 2.7 V 4.75 V
Supply Voltage-Nom (Vsup) 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm
Base Number Matches 3 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Type NOR TYPE

Compare AM29LV033C90EI with alternatives

Compare AM29F032B-75ECB with alternatives