AM29LV010B-90EI
vs
AM29LV001BT-90EE
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
FUJITSU LTD
|
CYPRESS SEMICONDUCTOR CORP
|
| Package Description |
TSSOP, TSSOP32,.8,20
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Access Time-Max |
90 ns
|
90 ns
|
| Command User Interface |
YES
|
YES
|
| Data Polling |
YES
|
YES
|
| Endurance |
1000000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PDSO-G32
|
R-PDSO-G32
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Sectors/Size |
8
|
1,2,7
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
128KX8
|
128KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP32,.8,20
|
TSSOP32,.8,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sector Size |
16K
|
8K,4K,16K
|
| Standby Current-Max |
0.000005 A
|
0.000005 A
|
| Supply Current-Max |
0.03 mA
|
0.03 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Toggle Bit |
YES
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
4
|
3
|
| Boot Block |
|
TOP
|
| Power Supplies |
|
3/3.3 V
|
|
|
|