AM29LV008B-100EC
vs
MX29LV008BBTI-90
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
MACRONIX INTERNATIONAL CO LTD
|
| Package Description |
,
|
TSOP1, TSSOP40,.8,20
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
TSOP1
|
| Pin Count |
|
40
|
| Access Time-Max |
|
90 ns
|
| Additional Feature |
|
BOTTOM BOOT BLOCK
|
| Boot Block |
|
BOTTOM
|
| Command User Interface |
|
YES
|
| Data Polling |
|
YES
|
| Endurance |
|
100000 Write/Erase Cycles
|
| JESD-30 Code |
|
R-PDSO-G40
|
| Length |
|
18.4 mm
|
| Memory Density |
|
8388608 bit
|
| Memory IC Type |
|
FLASH
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Sectors/Size |
|
1,2,1,15
|
| Number of Terminals |
|
40
|
| Number of Words |
|
1048576 words
|
| Number of Words Code |
|
1000000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
1MX8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSOP1
|
| Package Equivalence Code |
|
TSSOP40,.8,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
|
PARALLEL
|
| Programming Voltage |
|
3 V
|
| Qualification Status |
|
Not Qualified
|
| Ready/Busy |
|
YES
|
| Seated Height-Max |
|
1.2 mm
|
| Sector Size |
|
16K,8K,32K,64K
|
| Standby Current-Max |
|
0.000005 A
|
| Supply Current-Max |
|
0.03 mA
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
DUAL
|
| Toggle Bit |
|
YES
|
| Type |
|
NOR TYPE
|
| Width |
|
10 mm
|
|
|
|
Compare MX29LV008BBTI-90 with alternatives