AM29LV001BT-55JD
vs
AM29LV001BT-55JF
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SPANSION INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
LCC
|
|
| Package Description |
QCCJ,
|
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.51
|
|
| Access Time-Max |
55 ns
|
|
| Additional Feature |
TOP BOOT BLOCK
|
|
| Boot Block |
TOP
|
|
| JESD-30 Code |
R-PQCC-J32
|
|
| JESD-609 Code |
e3
|
|
| Length |
13.97 mm
|
|
| Memory Density |
1048576 bit
|
|
| Memory IC Type |
FLASH
|
|
| Memory Width |
8
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
32
|
|
| Number of Words |
131072 words
|
|
| Number of Words Code |
128000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Organization |
128KX8
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QCCJ
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
CHIP CARRIER
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programming Voltage |
3 V
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.556 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
|
| Supply Voltage-Nom (Vsup) |
3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
J BEND
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
11.43 mm
|
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare AM29LV001BT-55JD with alternatives