AM29LV001BB-70JFB
vs
AM29LV001BB-70JIB
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SPANSION INC
|
SPANSION INC
|
| Part Package Code |
QFJ
|
QFJ
|
| Package Description |
PLASTIC, LCC-32
|
PLASTIC, LCC-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
70 ns
|
70 ns
|
| Additional Feature |
MINIMUM 1000000 WRITE CYCLES
|
MIN 1000000 WRITE CYCLES; BOTTOM BOOT BLOCK
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| JESD-30 Code |
R-PQCC-J32
|
R-PQCC-J32
|
| JESD-609 Code |
e3
|
e0
|
| Memory Density |
1048576 bit
|
1048576 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
3
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
128KX8
|
128KX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Position |
QUAD
|
QUAD
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare AM29LV001BB-70JFB with alternatives
Compare AM29LV001BB-70JIB with alternatives