AM29F800BT-90DGK2
vs
AM29F800BT-90DWD2
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SPANSION INC
|
SPANSION INC
|
Part Package Code |
DIE
|
WAFER
|
Package Description |
DIE,
|
DIE,
|
Pin Count |
44
|
44
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
90 ns
|
90 ns
|
Additional Feature |
MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION
|
MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION
|
Alternate Memory Width |
8
|
8
|
Boot Block |
TOP
|
TOP
|
Data Retention Time-Min |
20
|
20
|
JESD-30 Code |
R-XUUC-N44
|
R-XUUC-N44
|
JESD-609 Code |
e3
|
e3
|
Memory Density |
8388608 bit
|
8388608 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Number of Words |
524288 words
|
524288 words
|
Number of Words Code |
512000
|
512000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
512KX16
|
512KX16
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIE
|
DIE
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
5 V
|
5 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
TIN
|
TIN
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Position |
UPPER
|
UPPER
|
Type |
NOR TYPE
|
NOR TYPE
|
Base Number Matches |
1
|
1
|
|
|
|
Compare AM29F800BT-90DGK2 with alternatives
Compare AM29F800BT-90DWD2 with alternatives