AM29F400BT-75DPI2
vs
AM29F400BT-75DWC2
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
SPANSION INC
|
| Part Package Code |
DIE
|
WAFER
|
| Package Description |
DIE,
|
WAFER-43
|
| Pin Count |
43
|
43
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
70 ns
|
70 ns
|
| Additional Feature |
MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION
|
TOP BOOT BLOCK
|
| Alternate Memory Width |
8
|
8
|
| Boot Block |
TOP
|
TOP
|
| Data Retention Time-Min |
20
|
|
| JESD-30 Code |
R-XUUC-N43
|
R-XUUC-N43
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
43
|
43
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
256KX16
|
256KX16
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
5 V
|
5 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| Command User Interface |
|
YES
|
| Data Polling |
|
YES
|
| Endurance |
|
1000000 Write/Erase Cycles
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Number of Sectors/Size |
|
1,2,1,7
|
| Package Equivalence Code |
|
DIE OR CHIP
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
16K,8K,32K,64K
|
| Terminal Finish |
|
TIN LEAD
|
| Toggle Bit |
|
YES
|
|
|
|
Compare AM29F400BT-75DPI2 with alternatives
Compare AM29F400BT-75DWC2 with alternatives