AM29F400BB-120DGC2 vs AM29F400BB-120DWI2 feature comparison

AM29F400BB-120DGC2 AMD

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AM29F400BB-120DWI2 Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code DIE WAFER
Package Description DIE, DIE, DIE OR CHIP
Pin Count 43 43
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 120 ns
Additional Feature MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
Data Retention Time-Min 20
JESD-30 Code R-XUUC-N43 R-XUUC-N43
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 43 43
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX16 256KX16
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Type NOR TYPE NOR TYPE
Base Number Matches 3 3
Rohs Code No
Command User Interface YES
Data Polling YES
Endurance 1000000 Write/Erase Cycles
JESD-609 Code e0
Number of Sectors/Size 1,2,1,7
Package Equivalence Code DIE OR CHIP
Ready/Busy YES
Sector Size 16K,8K,32K,64K
Terminal Finish TIN LEAD
Toggle Bit YES

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Compare AM29F400BB-120DWI2 with alternatives