AM29F200BT-75DWC1
vs
AM29F200BT-75DWI1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
ADVANCED MICRO DEVICES INC
Part Package Code
WAFER
WAFER
Package Description
WAFER-42
DIE,
Pin Count
42
42
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Additional Feature
TOP BOOT BLOCK
MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION
Alternate Memory Width
8
8
Boot Block
TOP
Command User Interface
YES
Data Polling
YES
Endurance
1000000 Write/Erase Cycles
JESD-30 Code
R-XUUC-N42
R-XUUC-N42
JESD-609 Code
e0
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Sectors/Size
1,2,1,3
Number of Terminals
42
42
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX16
128KX16
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Equivalence Code
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Sector Size
16K,8K,32K,64K
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Toggle Bit
YES
Type
NOR TYPE
Base Number Matches
3
3
Data Retention Time-Min
20
Compare AM29F200BT-75DWC1 with alternatives
Compare AM29F200BT-75DWI1 with alternatives