AM29F200BT-75DGE1
vs
AM29F200BT-75DGI1
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
SPANSION INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
DIE
|
|
| Package Description |
DIE-42
|
|
| Pin Count |
42
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.32.00.51
|
|
| Access Time-Max |
70 ns
|
75 ns
|
| Additional Feature |
TOP BOOT BLOCK
|
|
| Alternate Memory Width |
8
|
8
|
| Boot Block |
TOP
|
TOP
|
| Command User Interface |
YES
|
YES
|
| Data Polling |
YES
|
YES
|
| Endurance |
1000000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-XUUC-N42
|
|
| JESD-609 Code |
e0
|
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
|
| Number of Sectors/Size |
1,2,1,3
|
1,2,1,3
|
| Number of Terminals |
42
|
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Organization |
128KX16
|
128KX16
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Code |
DIE
|
|
| Package Equivalence Code |
DIE OR CHIP
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
UNCASED CHIP
|
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
YES
|
| Sector Size |
16K,8K,32K,64K
|
16K,8K,32K,64K
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Position |
UPPER
|
|
| Toggle Bit |
YES
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
3
|
3
|
| Power Supplies |
|
5 V
|
|
|
|
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