AM29F200BB70EI
vs
AM29F200BB70EF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
SPANSION INC
Part Package Code
TSOP
TSOP
Package Description
SOP,
SOP,
Pin Count
48
48
Reach Compliance Code
unknown
compliant
Access Time-Max
70 ns
70 ns
Additional Feature
CONFG AS 128K X 16; BOTTOM BOOT BLOCK
CONFIGURABLE AS 128K X 16
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e0
e3
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX8
256KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Base Number Matches
2
1
Pbfree Code
Compare AM29F200BB70EI with alternatives
Compare AM29F200BB70EF with alternatives