AM29F200BB70ED vs AM29LV200BT-70REC feature comparison

AM29F200BB70ED Spansion

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AM29LV200BT-70REC AMD

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Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SPANSION INC ADVANCED MICRO DEVICES INC
Part Package Code TSOP TSOP1
Package Description TSOP-48 MO-142DD, TSOP-48
Pin Count 48 48
Reach Compliance Code compliant unknown
Access Time-Max 70 ns 70 ns
Additional Feature CONFIGURABLE AS 128K X 16 TOP BOOT BLOCK
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 256KX8 256KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 5 V 3 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Base Number Matches 3 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Alternate Memory Width 16
Boot Block TOP
Length 18.4 mm
Seated Height-Max 1.2 mm
Terminal Pitch 0.5 mm
Type NOR TYPE
Width 12 mm

Compare AM29F200BB70ED with alternatives

Compare AM29LV200BT-70REC with alternatives