AM29F200BB-75WJD1 vs AM29F200BB-75DWE1 feature comparison

AM29F200BB-75WJD1 Spansion

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AM29F200BB-75DWE1 Cypress Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC CYPRESS SEMICONDUCTOR CORP
Part Package Code DIE
Package Description DIE-42
Pin Count 42
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 75 ns
Additional Feature BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-XUUC-N42
JESD-609 Code e3
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1
Number of Terminals 42
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 128KX16 128KX16
Package Body Material UNSPECIFIED
Package Code DIE
Package Shape RECTANGULAR
Package Style UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish MATTE TIN
Terminal Form NO LEAD
Terminal Position UPPER
Type NOR TYPE NOR TYPE
Base Number Matches 1 3
Command User Interface YES
Data Polling YES
Endurance 1000000 Write/Erase Cycles
Number of Sectors/Size 1,2,1,3
Package Equivalence Code DIE OR CHIP
Ready/Busy YES
Sector Size 16K,8K,32K,64K
Toggle Bit YES

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