AM29F200BB-55WJI1 vs AM29F200BB-55FE feature comparison

AM29F200BB-55WJI1 AMD

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AM29F200BB-55FE Cypress Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC CYPRESS SEMICONDUCTOR CORP
Part Package Code WAFER
Package Description WAFER-42
Pin Count 42
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 55 ns 55 ns
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-XUUC-N42 R-PDSO-G48
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1
Number of Terminals 42 48
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 128KX16 128KX16
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Type NOR TYPE NOR TYPE
Base Number Matches 2 3
Rohs Code No
Command User Interface YES
Data Polling YES
Endurance 1000000 Write/Erase Cycles
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Sectors/Size 1,2,1,3
Package Equivalence Code TSSOP48,.8,20
Peak Reflow Temperature (Cel) 260
Ready/Busy YES
Reverse Pinout YES
Sector Size 16K,8K,32K,64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.06 mA
Terminal Finish TIN LEAD
Terminal Pitch 0.5 mm
Toggle Bit YES

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