AM29F200BB-120WJC1 vs AM29F200BB-120DGK1 feature comparison

AM29F200BB-120WJC1 AMD

Buy Now Datasheet

AM29F200BB-120DGK1 Spansion

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SPANSION INC
Part Package Code WAFER DIE
Package Description WAFER-42 DIE,
Pin Count 42 42
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 120 ns 120 ns
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-XUUC-N42 R-XUUC-N42
Memory Density 2097152 bit 2097152 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 128KX16 128KX16
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIE DIE
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form NO LEAD NO LEAD
Terminal Position UPPER UPPER
Type NOR TYPE
Base Number Matches 1 1
Rohs Code Yes
Additional Feature BOTTOM BOOT BLOCK
JESD-609 Code e3
Terminal Finish MATTE TIN

Compare AM29F200BB-120WJC1 with alternatives

Compare AM29F200BB-120DGK1 with alternatives