AM29F200BB-120DTF1
vs
AM29F200BB-120WJI1
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SPANSION INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIE
WAFER
Package Description
SURF TAPE PACKAGE-42
WAFER-42
Pin Count
42
42
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
120 ns
120 ns
Additional Feature
BOTTOM BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-XUUC-N42
R-XUUC-N42
JESD-609 Code
e3
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
42
42
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX16
128KX16
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIE
DIE
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
UNCASED CHIP
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Position
UPPER
UPPER
Type
NOR TYPE
NOR TYPE
Base Number Matches
1
2
Compare AM29F200BB-120DTF1 with alternatives
Compare AM29F200BB-120WJI1 with alternatives